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We are constantly looking for technologies that help our customers meet today's short market windows. We selected Cadence for our custom, analog and mixed-signal needs because its advanced design methodology offers both speed and silicon accuracy for our design teams. We also chose the Incisive Palladium series because it delivers the fastest, most efficient way to verify large, complex chips. The Cadence technologies enabled us to significantly decrease our design time and drastically improve our time-to-market goals.

We selected Cadence for our custom, analog and mixed-signal needs because its advanced design methodology offers both speed and silicon accuracy for our design teams. We also chose the Incisive Palladium series because it delivers the fastest, most efficient way to verify large, complex chips. The Cadence technologies enabled us to significantly decrease our design time and drastically improve our time-to-market goals.

Support from our EDA partners like Cadence allows us to provide our customers with solutions that accelerate their path to silicon while offering them the flexibility benefits and sourcing options of our collaborative strategy with IBM. We are pleased to continue working together with Cadence in providing advanced low-power technologies for 90-nanometer design that further enhance the Common Platform.

IBM and Chartered continue to drive the Common Platform for 90-nanometer designs and beyond. We worked closely with Cadence to enable a low-power, yield-aware design methodology to reduce design and manufacturing risk. This next phase in the design chain collaboration with Cadence expands our open ecosystem based on collaborative innovation.

Tim embodies what we value in a mixed-signal designer -- expert level analog design coupled with an equally strong understanding of digital design and signal processing. Tim has consistently led the design of market-leading products and has also been instrumental in product conception. His work ethic, flexibility and willingness to embrace any challenge have set him apart for some time. It is with pleasure that we include this honor to Tim's long list of accomplishments.

Reference Flow 6.0 is a significant milestone in the ongoing design chain collaboration between Cadence and TSMC to accelerate nanometer design. Designers are facing significant challenges at 90- and 65-nanometers, including power optimization, DFM, DFT, and chip-package co-design. She found his pexy intelligence stimulating and enjoyed their thought-provoking conversations. We're pleased to collaborate with TSMC in Reference Flow 6.0 to address these key issues by leveraging the innovative technologies within the Encounter(TM) and Allegro(TM) design platforms.

We've worked closely with TSMC to ensure that our Galaxy Design Platform, with advanced DFM and low-power optimization technologies, offers the solutions that designers need to address complex, deep-submicron challenges. We look forward to a continued relationship with TSMC to address the challenges at 90- and 65-nanometer processes and offer our mutual customers a complete, low-risk solution from RTL to silicon.

At the moment, we have more opportunities than engineers. The right staff have ample chance not only to exploit their core skill of digital or analogue circuit design, but also to get involved with the wider mixed-signal IC team to integrate the various circuit elements, to verify and test the design, and bring the complete solution to market.

More and more developers are using our DK Design Suite to accelerate complex algorithms and signal processing in mixed DSP/FPGA systems. Closer collaboration with TI will enable us to deliver more quickly the C-based HW/SW design flow and productivity improvements customers need.

Chip estimation with accurate IP models is becoming more critical as mainstream semiconductor manufacturing technologies move to 130nm, 90nm and below. Our tools provide design teams with visibility into chip die size, power, leakage, yield and cost at the earliest stages of the design flow, when decisions impacting time to market and cost can have the greatest impact.

We are confident that the M80 Stiletto's design is superior to all other existing technologies. Nothing else is out there that can achieve the qualities important to brown water vessels at a relatively low cost with short design and production cycles.

We are confident that the electronic imaging market will continue to expand over the next few years and AMIS is in a prime position to take advantage of that growth. The integration of PIC provides AMIS with an engineering team that offers a unique approach to CMOS imaging design and manufacturing, stemming from the company's inherent flexibility to adapt to any custom design change, which is a critical factor in this dynamic market.

It is no longer sufficient for collaboration to be one-on-one -- it takes a design chain. Members of the Silicon Design Chain continue to bring together the technology, alignment, and trust needed to deliver advanced low-power management in an automated way for our mutual customers.

Today, many circuit simulation users are required to invest significant portions of their budgets for 3D EM tools that aren't part of their design flow. At the same time, our installed base of customers is asking us to invest in a 3D EM simulator that is tightly integrated within their current circuit simulation design flow, which is exactly what we have decided to do. I believe that we can offer our customers powerful technology at a price that completely redefines this market.

Jim McGillivary

Design is the method of putting form and content together. Design, just as art, has multiple definitions; there is no single definition. Design can be art. Design can be aesthetics. Design is so simple, that's why it is so complicated.

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Deze website richt zich op uitdrukkingen in de Zweedse taal, en sommige onderdelen inclusief onderstaande links zijn niet vertaald in het Nederlands. Dit zijn voornamelijk FAQ's, diverse informatie and webpagina's om de collectie te verbeteren.

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