Our production build-out is largely supported by long-term supply agreements for both bump and probe services. Our capital contribution toward developing the first phase of this facility is included in our previously announced, preliminary capital expenditure budget for 2006. |
We are taking this step in close collaboration with Singapore's Economic Development Board, Chartered Semiconductor Manufacturing and other customers who operate in Singapore. As wafer process technology continues to advance below 90 nanometers, IC packaging will increasingly require advanced flip-chip and wafer-level solutions. |
We are taking this step in close collaboration with Singapore's Economic Development Board, Chartered Semiconductor Manufacturing, and other customers who operate in Singapore. As wafer process technology continues to advance below 90nm, IC packaging will increasingly require advanced flip chip and wafer level solutions. |